【译】NedCard与NXP合作开发新款RFID SMD封装，适用于工业应用 - 展商动态-上海物联网展

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【译】NedCard与NXP合作开发新款RFID SMD封装，适用于工业应用

发布时间:2018-09-18

　　NedCard宣布推出MicroSON-3 SMD，采用NXP的兼容UHF Gen2v2的UCODE 8和UCODE 8m RFID芯片。MicroSON-3是一种小型无引线(SON)SMD封装，可通过PCB板嵌入到工业应用中。

　　MicroSON-3外形轻薄，可以承受工业及高温环境。该无引线封装通过将底面端子焊接到PCB来实现电接触。该公司报告称，MicroSON-3的小尺寸设计使其成为RFID标签芯片的合适封装。

　　【译】NedCard与NXP合作开发新款RFID SMD封装，适用于工业应用

　　工业应用中的RFID跟踪可以帮助企业实现物品识别和数据采集的自动化，从而提高质量，效率和工作流程。该公司解释说，跟踪可重复使用的物品和工具可以节省人力时间并降低更换成本。

　　NXP RFID解决方案营销总监Mahdi Mekic表示：“我们的UCODE 8芯片平台可在各类工业4.0应用中提供无与伦比的RFID性能，并针对密集RAIN RFID标签群的库存管理应用进行了优化。”

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